Pouya Asrar, PhD, is a mechanical engineer skilled in advanced thermal engineering, semiconductor packaging, and cross-functional program leadership. With a foundation in both research and industry, Pouya Asrar has built expertise in designing and delivering high-performance thermal solutions for complex electronic systems.

Pouya Asrar has contributed to some of the world’s leading technology companies. At Tesla, Inc., he worked on thermal management systems for in-vehicle infotainment platforms, combining simulation and experimental validation to optimize performance under real-world conditions. He later joined Amazon as a thermal Engineer, where he designed and validated cooling solutions for smart home devices.

Currently, as a senior manager in advanced packaging at Samsung Electronics, he leads customer-facing technical engagements and oversees the development of advanced semiconductor packaging solutions. His role involves coordinating cross-functional teams, aligning engineering execution with customer requirements, and ensuring delivery of high-quality, reliable solutions. With a continued focus on innovation in thermal management and semiconductor technologies, Dr. Asrar remains committed to advancing engineering solutions that improve performance, reliability, and scalability in next-generation systems.